M2M Module

Image

Data Rate(Max)

Operating Network Downlink Uplink
LTE-FDD 10Mbps 5Mbps
DC-HSPA+ 42Mbps 5.76Mbps
HSPA 14.4Mbps 5.76Mbps
WCDMA 384Kbps 384Kbps

Size

30.0 mm (W) X 34.95 mm (L) X 4.3 mm (H)

Weight

7g

External Interface

80-pins Board to Board connector

Parameters Descriptions
Chipset Qualcomm MDM9207 / WTR2965 / PMD9607
External Network Access LTE/HSPA/WCDMA
AIR Standard LTE Release 9(FDD) Cat.1
DC-HSPA+ R8 / HSPA+ R7 / WCDMA R99
Input Power Supply +3.7V/1A from PC and other equipment
Data Speed Down link : 10Mbps, Up link : 5Mbps
Operating System Windows 8/7/Vista/XP, Linux, Mac
RX Diversity Support
AT Commands Support
Operating Temperature -20ºC ~ +50ºC
Size 30(W) x 34.95(L)x4.3(H) mm
Weight 7 g
Mechanical Interface Board to Board connector, 80pin (Panasonic社 AXK5F80547YG)