M2M Module

Image

Data Rate(Max)

Operating Network Downlink Uplink
LTE-FDD 150Mbps 50Mbps
DC-HSPA+ 42Mbps 5.76Mbps
HSPA 14.4Mbps 5.76Mbps
WCDMA 384Kbps 384Kbps

Size

45 mm (W) X 45 mm (L) X 8.3 mm (H)

Weight

15g

External Interface

30-pins Board to Board connector

Parameters Descriptions
Chipset Qualcomm MDM9207 / WTR2965 / PMD9607
External Network Access LTE/WCDMA
AIR Standard LTE Release 9(FDD) Cat.4
DC-HSPA+ R8 / HSPA+ R7 / WCDMA R99
Input Power Supply +3.7V/1A from PC and other equipment
Data Speed Down link : 150Mbps, Up link : 50Mbps
Operating System Windows 8/7/Vista/XP, Linux, Mac
RX Diversity Support
MIMO 2X2
AT Commands Support
Operating Temperature -20ºC ~ +50ºC
Size 45mm (W) X 45mm (L) X 8.3mm (H)
Weight 15 g
Mechanical Interface Board to Board connector : 30pin (Panasonic AXK630347YG)