M2M Module

Image

Data Rate(Max)

Operating Network Downlink Uplink
LTE-FDD 100Mbps 50Mbps

Size

30.0 mm (W) X 51.0 mm (L) X 4.4 mm (H)

Weight

13g

External Interface

52-pins mini PCI-E connector

Parameters Descriptions
Chipset Qualcomm MDM9215 / RTR8600 / PM8018
External Network Access LTE
AIR Standard LTE Release 8(FDD) Cat.3
Input Power Supply and Input Power range +3.7V/1.2A from PC and other equipment
+3.3V~+4.2V
Data Speed LTE-FDD
Down link : 100Mbps, Up link : 50Mbps
Operating System Windows 8/7/Vista/XP, Linux, Mac
RX Diversity Support
MIMO 2X2
AT Commands Support
Operating Temperature -20ºC ~ +50ºC
Size 30.0 mm (W) X 51.0 mm (L) X 4.4 mm (H)
Weight 13 g
Mechanical Interface PCI Express Mini Card Form Factor (52pin) - Type F2